Solder powder is a main substance of solder paste that is used for soldering PCBs and devices.
We use high quality alloys to manufacture solder powder and minimize the oxidation of powder through a strict quality control.
Especially, our products’ particle-size distribution and oxygen density are more outstanding than JEDEC Standard.
We can also manufacture ultra-fine powder by request.
Specifications
Alloy
Melting Point(℃)
Sn/3.0Ag/0.5Cu
218 ℃
Sn/0.3Ag/0.7Cu
226 ℃
Sn/1.0Ag/0.5Cu
227 ℃
Sn/0.7Cu
227 ℃
Type
Under size Content
Size of product
Over size content
3
Less than 20 ㎛ Below 5wt%
20~ 45 ㎛
Over 45 ㎛ Below 3wt%
4
Less than 20 ㎛ Below 5wt%
20 ~ 38 ㎛
Over 38 ㎛ Below 1wt%
5
Less than 10 ㎛ Below 10wt%
10 ~ 25 ㎛
Over 25 ㎛ Below 10wt%
6
Less than 5 ㎛ Below 3wt%
5 ~ 15 ㎛
Over 15 ㎛ Below 3wt%
7
Less than 2 ㎛ Below 2wt%
2 ~ 11 ㎛
Over 11 ㎛ Below 2wt%
※ It can be changed by request the above specifications