CSB(Cored Solder Ball) forms bumps between a substrate and a chip and the core of the bumps keeps fixed height as designed and relieves an external impact as well.

DUKSAN Hi-Metal Co., Ltd. provides both standard and customized CSBs applying solder plating technology and high temperature jetting technology.

DUKSAN Hi-Metal Co., Ltd. provides high-quality CSBs based on well-defined solder ball manufacturing technology, process and quality by maintaining constant temperature and humidity and strict size-tolerance.