Solder Paste

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About Solder Paste

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Solder paste is a necessary substance for SMT(Surface Mounting Technology) and a formation of Flip Chip Bump that further Soldering technology as electronic components keep being developed.

Based on our self-developed manufacturing technology of ultra-fine powder and binder system, we provide highly reliable solder paste which has good printability and wettability.

  • MMP Paste (Metal Mask Printing Solder Paste)
    Filing a hole in metal mask stencil with solder paste
  • DFR(Dry Film Resister) / WLP(Wafer Level Package) Solder Paste
    Filing a hole in stencil like film with solder paste

Specifications

Metal Mask Printing Solder Paste
Name Alloy Powder Size Flux Content Viscosity Feature
PSM Sn/3.0Ag/0.5Cu
(Ultra Low Alpha)		 2~8㎛ 11.0 270±50 Fine Pitch Products
PTM 2~11㎛ 10.5 ~ 14.0 270±50 Standard Products
UTM 2~11㎛ 10.5 ~ 11.5 270±50 ULA products (Less than 0.002 cph/㎠)
(P)VM Sn/3.0Ag/0.5Cu
Sn/4.0Ag/0.5Cu
Sn/0.3Ag/0.7Cu
Sn/3.5Ag/0.5Bi/8In		 10~25㎛ 10.5 ~ 12.0 230±50 Available for special composition
(P)WM 20~38㎛ 10.5 ~ 12.0 230±50 Low void and high reliability
  • good printability and high reliability
  • Low void content
DFR / WLP Solder Paste products
Name Alloy Powder Size Flux content Viscosity Feature
PSD Sn/3.0Ag/0.5Cu
(Ultra Low Alpha)		 2~8㎛ 10.5 ~ 12.0 50 ~ 150 Pa.s Products for ultra-fine Pitch
PTD 2~11㎛ 10.5 ~ 12.0 50 ~ 150 Pa.s Standard products
UTD 2~11㎛ 10.5 ~ 12.0 50 ~ 150 Pa.s Standard products
(F)VW Sn/3.0Ag/0.5Cu
Sn/4.0Ag/0.5Cu
Sn/0.3Ag/0.7Cu
Sn/3.5Ag/0.5Bi/8In		 20 ~ 38㎛ 10.5 ~ 12.0 80 ~ 150 Pa.s Products for Wafer Level
  • Excellent gap filling of hole and eliminating void
  • Viscosity rese proof feature in case of long printing operation
BGA/MSB Flux
Name Type Viscosity Halogen Feature
BW100 Water Clean 20Pa.s N.D SMT&Flip Chip bumping
PTD Water Clean 20Pa.s N.D Micro solder ball bumping

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