Solder ball is key part of a semiconductor packaging technology like BGA and CSP.
Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.
DUKSAN Hi-Metal Co., Ltd. provides high-quality products that can realize smaller size,
lighter weight and higher function of semiconductors and mobile devices using self-developed unique method.
Specifications
Diameter(㎜)
Tolerance(㎜)
Cpk
0.762~0.600
± 0.025
≥ 1.67
0.599~0.500
± 0.020
≥ 1.67
0.499~0.400
± 0.015
≥ 1.67
0.399~0.251
± 0.010
≥ 1.67
0.250~0.199
± 0.003
≥ 1.67
0.099~0.030
± 0.003
≥ 1.67
※ It can be changed by Customer's Request
Manufacturing high-quality products by a constant temperature and humidity control and an automated system
Various compositions and diameters on demand
Strict dimensional and dispersion management
Customized products for other industry fields
Application Fields
Solder ball connects materials in the electronic industry and is used for electric contact of electronic devices which utilized
in smartphones and tablets PCs which are highly related to our daily life.