ACF is film-shaped connecting material that comprises conductive particle and resins and providing one directional
electrical contact and chemical bonding among display, drive IC, PCB and etc.
Conductive particle
Conductive particle is a key component of ACF,
that anisotropically control electrical current(up and down: conduction, left and right: insulation).
Specifications
DUKSAN Hi-Metal Co., Ltd. can provide all the products that fulfill customers’ requirements from Polymer Core to insulating coating.
Polymer core size : 2~20um, CV(coefficient of variation)<3%
Size control : Control the average size by 0.1um
Core Property : Property control according to each application fields(TSP(Touch Screen Panel), FOG(Film on Glass), OLB(Outer Lead Bonding), COG(Chip on Glass) and etc.)
Core Material: A sort of styrene, acrylic and mixture
Metal Material: Ni, Au, Cu, Ag, Ni Alloy and etc.
Metal Thickness: 50~300nm
Insulation Particle: 50~300nm, control the average size each 10nm
Application Fields
Forming connections with Anisotropic Conductive Film by applying heat and pressure.