CSB(Cored Solder Ball) forms bumps between a substrate and a chip and
the core of the bumps keeps fixed height as designed and relieves an external impact as well.
DUKSAN Hi-Metal Co., Ltd. provides both standard and customized CSBs applying solder plating technology and high temperature jetting technology.
DUKSAN Hi-Metal Co., Ltd. provides high-quality CSBs based on
well-defined solder ball manufacturing technology, process and quality by maintaining constant temperature and humidity and strict size-tolerance.
Cored Solder Ball can be applied to highly reliable solder joint instead of normal solder ball.